Capability
CAPABILITY
Testing Process & Final Assembly
We flexibly cater to diverse customer requirements, including ROM writing, room temperature and high-temperature functional tests, cover-to-base assembly, conformal coating, bonding, and more.
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| ASSEMBLY | |
|---|---|
| Number of Line | 6 Lines |
| Conformal Coating | Establishment and operation of facilities according to customer specifications. |
| Rom Writing | Establishment and operation of facilities according to customer specifications. |
| Function Test | Establishment and operation of facilities according to customer specifications. |
| Aging Test | Establishment and operation of facilities according to customer specifications. |
| Hot Test | Establishment and operation of facilities according to customer specifications. |
Testing Process & Final Assembly
1. ROM Writing
- A programming process of transferring flash ROM data onto PCB assemblies
Testing Process & Final Assembly
2. Funtion Test
- An inspection process of product functionality under room temperature conditions
Testing Process & Final Assembly
3. Aging Test
- A process of evaluating product integrity through repeated tests under load to detect abnormalities
Testing Process & Final Assembly
4. Conformal Coating
- A process of applying a protective coating solution onto PCB assemblies to shield against contaminants
Testing Process & Final Assembly
5. Cover & Base Assembly
- A process of securing the cover and base enclosures using fasteners to protect the product
Testing Process & Final Assembly
6. Hot Test
- A process of assessing product performance and functionality under elevated temperature conditions
Testing Process & Final Assembly
7. Shipment Inspection & Packaging
- Final quality check and packaging process before delivery to customers